Helmut Fischer at Electronica 2026: Measurement Solutions for the Electronics Industry

Created by OM AnalyticsHelmut Fischer
Helmut Fischer Electronica 2026
Helmut Fischer will be exhibiting high-end measurement and analysis instruments for quality assurance of electronic surfaces at Electronica 2026 (Photo: Fischer)

At the Electronica 2026 trade show in Munich, the Helmut Fischer Group will present innovative measurement solutions for the electronics industry—quality assurance for electronic surfaces.

From November 10 to 13, the electronics industry will gather at Electronica, the world’s leading trade fair in Munich, to showcase the latest technologies and discuss trends and developments. As structures become smaller and smaller and requirements become ever more demanding, precise and reliable measurement technology is essential. As an internationally established technology leader, Fischer offers solutions for a wide range of applications in the electronics industry, including coating thickness measurement and material analysis. Whether printed circuit boards, wafers, connectors, wires, or other electronic components—from manual measuring instruments to automated systems—Fischer develops technologies tailored to the specific requirements. With the new FischerScope Xdal 650, Helmut Fischer presents a high-end XRF instrument for the precise measurement of thin and complex coatings as well as material analysis in the ppm range. This includes, for example, determining the phosphorus content in NiP layers as well as measuring functional layers in the electronics and semiconductor industries, such as on lead frames, connectors, or printed circuit boards. In combination with the intuitive Fisiq X software, the instrument enables fast and efficient measurement processes for precise quality control.

Precise Analyses for Electronics, Semiconductors, and Wafers

Also on display at Electronica 2026 is the FischerScope X-RAY XDV-µ Wafer for measuring the smallest structures on wafers up to 12 inches in diameter and analyzing very thin coatings. The Ultra microfocus X-ray tube enables high measurement performance even with the smallest spot sizes. In addition to the XRF instruments, visitors will gain insight into the SR-Scope DMP30 for measuring copper thickness on printed circuit boards, as well as various other tactile handheld devices and measurement probes for coating thickness measurement. At Booth 648 in Hall A4, Fischer experts will be available for one-on-one discussions and personalized consultations.

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