Hoenle: UV-curable sealing material for electronics housings
With Vitralit CIPG 60200, Hoenle presents a UV-curable polyacrylate sealing material for complex electronic housings in automotive and e-mobility applications. The cured-in-place gasket technology enables precise dosing and fast curing with high chemical and thermal resistance.
Liquid gaskets offer a simple yet highly effective way of reliably sealing even complex three-dimensional geometries that are difficult to achieve with conventional stamped or solid gaskets. With Vitralit CIPG 60200, Hoenle is presenting a blue fluorescent, UV-curable polyacrylate sealing material that has been specially developed for electronic housings in the automotive and e-mobility industries. The solution is based on Cured-In-Place-Gasket technology (CIPG) and will be presented for the first time at the Coiltech trade fair in Augsburg. The CMR-free polyacrylate formulation can be precisely applied using adhesive metering valves and programmable robots. This results in a defined bead geometry with high dimensional stability in the uncured state. Subsequent curing takes place under UV light, for example with LED systems at 365 or 405 nm or with gas discharge lamps. Fast UV curing results in short cycle times and immediate handling stability of the components.
Polyacrylate sealing material for automotive applications
After curing, the material ensures a reliable sealing effect under compression and prevents the escape of liquids and gases. The elastic resilience is retained even at elevated temperatures. A compression set of 15 percent after 24 hours at 150 °C underlines the long-term sealing performance. The possible application range extends from temperatures below -40 °C to over 150 °C. The cured gasket also exhibits high chemical resistance to typical media from the automotive sector, including engine oil, automatic transmission oil and water-glycol mixtures. Due to its low outgassing properties, the material is also suitable for sensitive electronic assemblies. Applications include electronic housings for control units, battery disconnection systems, on-board chargers and cell module controllers. In addition to use in series production, the solution is also designed for maintenance and repair scenarios. In contrast to conventional disposable seals, the cured CIPG material can be reused after a housing has been opened. This reduces service costs and material consumption while maintaining process reliability in demanding electronics applications.