Hannover Messe organizes AI conference for the industry
Deutsche Messe's first "Artificial Intelligence (AI) in Industry" conference will take place on January 24, 2024. For many industrial companies, AI…
Peters introduces new Elpepcb PP 2794 filling paste for printed circuit boards
Peters Lackwerke presents Elpepcb PP 2794, a new PCB filling paste for filling holes. The thermally curing via filler enables bubble-free and even…
New adhesives for photovoltaic applications from Panacol
Panacol has developed new specialty adhesives for organic and perovskite-based photovoltaic applications. For these, the adhesives offer higher…
Consultation on PFAS restriction closed
The six-month public consultation on the PFAS restriction proposal has ended. A total of 5600 comments from 4400 organizations, companies and…
Henkel Adhesive Technologies creates sustainability assessment methodology
An external audit of Henkel Adhesive Technologies underscores the company's commitment to portfolio transformation to strengthen its contribution to…
New BASF dashboard enables sustainable procurement
BASF offers customers a new digital app that gives them comprehensive insight into the sustainability status of the product portfolio they buy from…
New Ceresana market study "Bio-based solvents
In the new market study "Bio-based solvents", the market research institute Ceresana expects growth in the global market for bio-based solvents. The…
Henkel opens first Battery Engineering Center
As a leading manufacturer of adhesives, sealants and functional coatings, Henkel has opened a pioneering Battery Engineering Center at its Inspiration…
RAL Farben launches digital color libraries
With the new digital RAL color libraries the RAL color values can be imported into different graphic programs to be able to work digitally with RAL…
Fast-curing SMD adhesive from Panacol for precise dispensing
Panacol will be presenting its new Structalit 5604 adhesive at BondExpo 2023 in Stuttgart. This is an extremely fast-curing adhesive that has been…
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