Panacol introduces new optical adhesives

Created by OM Special TopicsPanacol
Panacol optical adhesives Resins Imprint and optical bonding applications
New optical adhesives and resins from Panacol: An epoxy resin adhesive is used as an imprint material for nanostructures on a glass wafer (Image: Panacol)

Panacol will present new optical resins and adhesives for imprint and optical bonding applications at SPIE Photonics West in San Francisco, USA. These new adhesives can be used for light carpet modules, sensors in electronic devices and wearables.

Panacol has developed special adhesives for the production of refractive lenses and diffractive optical elements (DOEs) suitable for micro- and nano-imprint lithography, wafer level optics and optical wafer bonding. The new Vitralit UC 1632 and Vitralit UC 1658 adhesives are in the viscosity range of 100 to 200 mPas and can therefore be easily applied by puddle dispensing, spin coating or jetting. They offer excellent adhesion to all common glass wafers and to new polymer substrates such as optical PET or PC. After application and imprinting, they cure very quickly under UV light, creating a precise and permanent structure on the wafer. The two adhesives mentioned meet the high requirements for optical reliability, such as low yellowing, temperature stability and dimensional stability.

For black coating and optical edge sealing, Panacol also offers a black UV-curing adhesive, Vitralit BL UC 1103. This black epoxy adhesive is permeable to UV light when uncured. After curing, it is opaque and impermeable to light. For optical bonding and alignment, Panacol has developed the UV-curable adhesives Vitralit 7311, Vitralit VBB-60 and Vitralit 1860 as well as the thermally curing adhesives Structalit 5531 and Structalit 5511. These adhesives are characterized by high adhesion to glass and common plastic substrates. The Vitralit UD 8057 adhesive is designed for dual curing with UV/visible light and humidity. This means that the adhesive can also post-cure in shadow areas that cannot be reached with UV/visible light due to the air humidity and thus cure completely. These adhesives for optical bonding can be cured with high-intensity LED systems from Hönle, which are perfectly matched to the wavelengths of the Panacol photoinitiators. After curing, these Panacol adhesives are flexible and stress equalizing, which facilitates the bonding of substrates with different thermal expansion coefficients. The new adhesives can be used for light carpet modules in the automotive industry, for sensors in electronic devices and wearables as well as for the generation of structured light in projectors or time-of-flight sensor applications. Panacol will be exhibiting at SPIE Photonics West in San Francisco, USA, from January 30 to February 1, 2024, at booth 4342.

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