Fast-curing SMD adhesive from Panacol for precise dispensing
Panacol will be presenting its new Structalit 5604 adhesive at BondExpo 2023 in Stuttgart. This is an extremely fast-curing adhesive that has been specially developed for bonding SMDs to printed circuit boards.
Structalit 5604 from Panacol is a one-component epoxy resin adhesive that contrasts well with green PCB material due to its red color. This allows optical inline inspection to be ensured. The one-component adhesive can be dispensed by jet dispenser, classic needle dispensing or screen printing. Its ideally adjusted viscosity and high thixotropy index enable excellent dispensing speed, precise dot profile and very good wet adhesion for the curing process. Curing occurs thermally within a few minutes, even at low temperatures. Structalit 5604 can withstand extreme temperatures of up to 270° C for a short time and is therefore also suitable for reflow soldering processes.
In the cured state, Structalit 5604 is particularly shock-resistant and adheres excellently to FR4 circuit boards, to metals and to epoxy-based mold materials. Due to its high glass transition range of >115° C, the adhesive retains its excellent bond strength even at elevated temperatures and is therefore particularly suitable for the production of electronic assemblies. Since Structalit 5604 was developed specifically for use in electronics, it has high ionic purity and thus provides optimum protection against internal corrosion and local element formation. Panacol will be exhibiting at BondExpo in Stuttgart from October 10 to 13, 2023 in Hall 5, Booth 5417.