Panacol: Adhesives and UV-curing systems for flexible electronics

For OPV applications, Panacol has developed new UV and UV LED curing adhesives specifically for the lamination of barrier films. These adhesives offer higher resistance to environmental stresses, improved compatibility with the PV material and a low WVTR (Water Vapor Transmission Rate). Because these adhesives cure quickly under UV light, they are particularly suitable for high-throughput processes, including roll-to-roll processes, which can be carried out with greater efficiency and reduce the total cost of ownership. Adhesive requirements, such as flow properties, can be modified to perfectly match the application process. Flexible and pliable UV adhesives have also been developed by Panacol for more traditional applications on flexible circuits. These include new underfills for die attach applications as well as edge bonding adhesives and adhesives for component attachment. All Panacol UV adhesives can be easily cured with Hönle's high-intensity UV and/or UV LED curing systems, which are perfectly matched to the wavelengths of Panacol photoinitiators. Options range from 3mm diameter spot units to linear LED arrays over a meter in length, making them the perfect choice for smaller and larger irradiation areas.

Panacol's latest conductive adhesives can efficiently attach flexible resistors and create flexible electrical connections in solar cells, touch sensors and wearable devices. These include a one-component, silver-filled conductive adhesive that bonds very well to plastics, including polyimide, PC, PVC, ABS and FR4 sheets. Once cured, the adhesive is very flexible and has a high peel strength, making it the perfect choice for use in applications subject to vibration, oscillation or rapid temperature fluctuations. A major advantage is its very easy handling and storage, as it only needs to be stored refrigerated, not frozen. It is easy to dispense and cures within minutes at temperatures of up to 100 °C. This enables the fixing of semiconductors and the production of electrical connections in a single step. The specific requirements of the application and manufacturing conditions are important factors to consider when selecting the adhesive. Significant benefits can be achieved when the component design, adhesive properties and curing process (UV or thermal) are precisely matched. Panacol works closely with manufacturers in all areas to help them develop an optimized bonding process. This leads to greater efficiency and a reduction in the total cost of ownership.