Through-hole plating

In electroplating, through-hole plating plays an important role as a key process for creating electrical connections between different layers of a substrate. This process is particularly relevant in the electronics industry, especially in the production of printed circuit boards.

Through-hole plating, also known as via technology, refers to the process of creating electrically conductive connections through the insulating layer of a substrate. This is usually done by inserting holes or drill holes, which are then filled with conductive material. The process can be realized by various methods, including mechanical drilling, laser drilling or chemical etching.

Once the holes have been drilled, through-hole plating is carried out by applying conductive material, typically copper, to the prepared holes. This can be done by electrodeposition (electroplating), where copper is deposited from a solution onto the surface and fills the holes. The excess material on the surface is then removed to ensure a flat surface.

Through-hole plating plays a crucial role in the production of printed circuit boards, as it enables electrical connections to be made between different layers. This allows complex circuits to be realized, which is essential in the electronics industry. The precision and reliability of through-hole plating techniques significantly influence the performance and reliability of electronic devices.