Tenting technique

The tenting technique, also known as "tenting" or "tenting sealing", is a method used in the electronics industry, particularly in PCB manufacturing and assembly. It refers to the process of sealing or covering certain areas of a PCB to protect it from external influences such as moisture, contamination or mechanical damage.

In surface technology, the tenting technique is mainly used for drilling vias on printed circuit boards. Vias are holes that extend from one side of the PCB to the other and enable electrical connections to be made between different layers. When drilling vias, there is a risk of drilling chips or chemical residues entering the via and causing short circuits or other faults.

The tenting technique solves this problem by sealing the vias with a protective material after drilling. This can be done by applying a thin layer of epoxy resin or a special solder resist. Sealing the vias prevents the ingress of foreign materials and creates a protective barrier that ensures the integrity of the PCB.

In addition, the tenting technique also provides improved mechanical stability for the vias by reinforcing their edges, reducing the risk of cracking or breaking. This is particularly important in applications where the PCBs are exposed to high loads or vibrations.

Overall, tenting technology helps to improve the reliability and longevity of PCBs by protecting them from environmental influences and mechanical damage. It is an important part of the PCB manufacturing process and is used in various industries, including electronics, telecommunications, medical technology and the automotive industry.

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This definition is taken from the surface technology encyclopedia from Surface Technology Online. You can find many more technical terms from the surface technology industry in our lexicon overview.

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