Sputtern

Sputtering is a process for producing thin layers on surfaces by bombarding a target with ions. In this process, high-energy ions are fired at the target material, causing atoms or molecules of the target to be dissolved out. These dissolved particles are then deposited on the surface of a substrate to form a thin film.

The target material can consist of different metals, alloys or other materials, depending on the desired properties of the deposited layer. The sputtering process allows precise control of the thickness, composition and microstructure of the deposited layer, making it a versatile technique for a wide range of applications.

Sputtering is used in microelectronics, semiconductor manufacturing, optoelectronics, solar cell manufacturing, coating of optical components and many other areas. It offers high reproducibility, good adhesion properties and the ability to produce coatings with high purity and homogeneity. Sputtering is an important process in materials and surface technology that contributes to the development and manufacture of innovative products and technologies.

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This definition is taken from the surface technology encyclopedia from Surface Technology Online. You can find many more technical terms from the surface technology industry in our lexicon overview.

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