Semi-additive technology

Semi-additive technology is a process used in the production of printed circuit boards to create complex circuit patterns. In contrast to conventional additive and subtractive technology, semi-additive technology combines elements of both processes to create precise and high-resolution conductor paths.

The process begins with a substrate, which is often made of a conductive material such as copper. First, a thin layer of dielectric is applied to the substrate. A thin layer of conductive material, such as copper, is then applied to the dielectric layer.

A photoresist is then applied to the copper layer and exposed to light. Exposure hardens the photoresist in certain areas, while it remains soft in others. The photoresist is then developed in the hardened areas, creating exposed copper areas that are crucial for the formation of conductive tracks.

The unprotected copper areas are then etched, creating the desired circuit traces. After etching, the remaining photoresist is removed and the PCBs undergo a cleaning and inspection procedure to ensure that the desired circuit patterns have been created correctly.

Semi-additive technology enables the production of high-precision and complex PCBs with fine traces and tight spacing between the traces. It offers an efficient way of producing modern electronic devices with increasingly complex circuits and thus contributes to the further development of the electronics industry.