Pulse-Plating

Pulse plating, also known as pulse plating, is an electrochemical coating process used in surface technology and electroplating. In contrast to continuous DC plating, in pulse plating the current is applied to the surface to be coated in discrete pulses.

This intermittent approach offers several advantages. On the one hand, pulse plating enables more precise control of the deposited layer thickness and structure. Through the targeted application of pulse sequences, finer, more uniform layers can be produced. This is particularly important in the production of thin coatings for electronic components or precision components.

Another advantage of pulse plating is that it improves the quality of the deposited layer. By varying the pulse parameters, such as pulse shape, duration and frequency, undesirable effects such as pores, cracks or irregularities can be reduced. This leads to surfaces with improved mechanical and electrical properties.

Pulse plating is used in various industries, including electronics, automotive, jewelry manufacturing and surface finishing. In the electronics industry, it is often used to apply extremely thin metallic layers to printed circuit boards or semiconductor components. Thanks to the precise controllability of the process, even complex layer structures with different material properties can be realized.

The continuous further development of pulse plating technologies helps to optimize the efficiency and flexibility of this electrochemical coating process and to meet the increasing demands of the industry.