Plasma etching

Plasma etching is a process used in microfabrication and material processing to create precisely structured surfaces or patterns on materials. It uses a plasma consisting of an ionized gas to selectively remove material to create the desired pattern.

In this process, the material to be etched is placed in a vacuum chamber and exposed to a plasma. The plasma contains reactive species such as ions, electrons and free radicals that undergo a chemical reaction with the surface of the material. This reaction removes material from the surface, resulting in etching.

Plasma etching offers several advantages over traditional etching methods, including precise control over etch rate and shaping, high pattern reproducibility and the ability to etch a variety of materials, including metals, semiconductors and polymers.

The process is used in various applications, including the manufacture of microchips, the microstructuring of surfaces for biotechnology and the manufacture of microfluidic devices. It enables the production of complex and precise structures on small scales and thus contributes to the further development of technologies in various fields.

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This definition is taken from the surface technology encyclopedia from Surface Technology Online. You can find many more technical terms from the surface technology industry in our lexicon overview.

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