Deposition rate

The deposition rate is a decisive parameter in metal deposition, which indicates how quickly a metallic layer is formed on a surface. It is usually measured in micrometers per hour (µm/h) or nanometers per second (nm/s) and significantly influences the efficiency and quality of the coating process.

In electrochemical processes such as electroplating, the deposition rate depends on various factors, including the current density, the composition and temperature of the electrolyte as well as the conductivity and geometry of the workpiece. A higher current density generally leads to faster deposition, but can affect the uniformity and adhesion of the coating.

In chemical deposition processes such as chemical or physical vapor deposition (CVD or PVD), the speed is influenced by parameters such as gas flow, pressure, temperature and the chemical reactivity of the starting materials.

The optimum deposition speed is always a trade-off between process duration, coating quality and cost-effectiveness. Too high a speed can cause defects such as porosity or stresses in the coating, while too low a speed reduces the efficiency of the process. Precise control of the process conditions is therefore essential in order to achieve uniform, defect-free and functional metal coatings.