Composite electroforming

Composite electroforming is a specialized manufacturing process used in microelectronics and microsystems technology. This process enables the precise manufacture of microstructures and microcomponents on small scales and is particularly useful in the manufacture of micro-optics, sensors and other high-precision components.

Composite electroforming combines electroforming and the use of photoresist patterns to create three-dimensional microstructures on substrates. The process consists of several steps:

1. Substrate preparation: First, the substrate on which the microstructures are to be produced is prepared. This substrate can consist of various materials, including silicon, glass or plastic.
2. Application of the photoresistive pattern: A photoresistive material is applied to the substrate. This material is photosensitive and can be formed by exposure to UV light. A mask pattern is placed over the photoresistive material and UV light is transmitted through the mask onto the photoresistive film. This step defines the desired pattern.
3. Electroplating: After exposure, the substrate is immersed in an electrolyte solution and electroplating begins. In this step, the desired material (e.g. metal) is deposited from the electrolyte solution onto the substrate. The previously exposed areas of the photoresist material act as masks and prevent the material from being deposited in these areas. The unexposed material is deposited and forms the desired microstructures.
4. Removing the photoresist material: Once the electroforming process is complete, the remaining photoresist material is removed to expose the exposed microstructures.

Composite electroforming enables the production of complex microstructures with high precision and repeatability. It is used in areas such as micro-optics, microfluidics, sensor technology and MEMS (microelectromechanical systems), where the production of precise microcomponents and structures is of crucial importance.