Chemical vapor deposition

Chemical vapor deposition (CVD) is a process for producing thin films on substrates that is used in a variety of industrial applications. This process enables precise control over the thickness, composition and structure of the deposited layers and is used in areas such as semiconductor production, surface technology, tool coating and nanomaterial synthesis.

In vapor deposition, one or more gaseous precursor chemicals, often in the form of organometallic compounds or halides, are introduced into a reaction chamber containing the substrate to be coated. Through a suitable combination of temperature, pressure and gas flow, the precursor chemicals are activated thermally or by plasma, causing them to decompose or react into reactive species. These reactive species are deposited on the surface of the substrate and form a thin layer.

The deposited layers can consist of various materials, including metals, semiconductors, semiconductor compounds, ceramics and carbon. Depending on the specific requirements of the application, the deposited layers can have different properties, such as electrical conductivity, optical transparency, hardness, wear resistance or chemical resistance.

An important advantage of vapor deposition is its ability to deposit uniform and high-quality coatings on complex-shaped substrates, which makes it particularly attractive for the production of microelectronic devices, optical coatings and coatings for tools and components.

The different types of vapor deposition include chemical vapor deposition (CVD), physical vapor deposition (PVD), plasma-enhanced chemical vapor deposition (PECVD) and atmospheric pressure CVD (APCVD). Each variant has its own advantages and disadvantages in terms of process control, layer quality, speed and areas of application. Overall, vapor deposition is an extremely versatile and efficient process for producing customized coatings with precise properties for a wide range of industrial applications.