Bumping

Bumping is a phenomenon that occurs in electroplating and indicates unwanted metallic deposits that form on the surface of the workpiece to be coated during the plating process. These unwanted deposits can have various causes, including impurities in the electrolyte, uneven current distribution or inadequate pre-treatment of the workpiece.

During the electroplating process, the workpiece to be coated is immersed in an electrolyte bath as a cathode, while an anode is also placed in the solution. By applying an electrical voltage, a current flow is generated which causes metal ions to be dissolved from the anode and deposited on the cathode. Ideally, the deposition takes place evenly over the entire surface of the workpiece, resulting in a smooth and homogeneous coating.

Bumping occurs when unwanted metal deposits form on the surface, which can impair the quality of the coating. These deposits can appear as irregular spots or dots and affect the aesthetics of the coated surface. They can also lead to functional limitations or mechanical problems, especially if they occur in critical areas.

Careful process control and monitoring is required to avoid bumping . This includes control of the electrolyte composition, optimization of current density and distribution, and thorough pre-treatment of the workpiece to remove surface contaminants and ensure good adhesion of the coating. These measures can minimize the occurrence of bumping, resulting in high quality and reliable electroplated coatings.