Umicore MDS: Copper process for printed circuit board coating
Umicore MDS, as sales partner of the Japanese plating specialist Uyemura, has successfully installed the advanced Thru-Cup EVF-YF9 copper process for the electroplating of blind vias (blind holes) at the high-tech pcb manufacturer Hi-Tech Corporation in North Macedonia.
Thru-Cup EVF-YF9 is an electrolytic copper process that has been specially developed for the reliable filling of blind vias. It offers exceptional process stability, in particular thanks to the (CVS) analyzability of all additives used, a long service life and enables the simultaneous plating of through-hole vias (PTH) and blind vias in panel and pattern technology - a decisive advantage for the production of complex HDI PCBs. The process is also REACH-compliant and meets the highest environmental compatibility requirements. Thru-Cup EVF-YF9 is an advanced additive system for the electrolytic copper plating of printed circuit boards. It is used in panel and pattern plating of blind holes and simultaneous through-hole plating.
Copper coating for blind vias and through-hole plating
"The installation at Hi-Tech in close cooperation with the process supplier Uyemura and the participating system manufacturer from Europe is an excellent example of successful international cooperation," explains Andreas Groß, Head of PCB Processes at Umicore MDS. "Especially in times when Europe is losing importance in the PCB manufacturing sector and dependence on Asian markets is growing, such projects are particularly important. They show how the European industry can once again position itself competitively - through the targeted selection of reliable project partners and trusting cooperation at all levels." Hi-Tech Corporation, based in Skopje, has been a leading manufacturer of complex printed circuit boards for demanding applications in the automotive, telecommunications, medical technology and industrial sectors for over 40 years. Umicore MDS supports its long-standing customer Hi-Tech in securing its technology leadership in the global competitive environment by providing innovative coating solutions.
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