Trumpf: Coating of Glass Substrates for AI Chips

The race for more powerful AI chips is increasingly shifting toward advanced packaging. Glass substrates make it possible to pack more functions into a smaller space and transfer data faster within the chip. To achieve this, millions of microscopic through-glass vias (TGVs) are etched into the glass and then coated with a conductive material. The challenge lies in the geometry: the holes are very deep and narrow at the same time. Even a small number of improperly coated through-glass vias can render an entire glass panel unusable. To address this, Trumpf has developed an industrial HiPIMS process designed to enable reproducible coating of these structures. For mass production, the focus is on process stability and the highest possible yield.

HiPIMS Plasma Coats Deep Through-Glass Vias

HiPIMS (High Power Impulse Magnetron Sputtering) generates a highly ionized plasma with a higher proportion of electrically charged particles than conventional methods. Electrical and magnetic fields can be used to precisely direct the ions into deep and narrow structures. This is intended to achieve a more uniform coating of the through-glass vias. The higher ionization also results in a higher density of deposited molecules and, according to Trumpf, improves coating quality. In addition to HiPIMS, Trumpf offers other technologies for advanced packaging. These include ultrashort-pulse lasers for the production of through-glass vias, as well as plasma power supplies for coating and etching processes. The technologies are specifically aimed at the industrial production of high-performance chips for artificial intelligence, data centers, and high-performance computers.