Panacol with new conductive adhesive for photovoltaic cells

Panacol has developed a new flexible, conductive adhesive for perovskite and organic photovoltaic (OPV) cells. Elecolit 3648 can be used for electronic components where soldering is not an option due to heat generation, inflexibility and rigidity.
Perovskite-based and organic photovoltaic (OPV) cells are a promising way to generate renewable energy as they are lightweight, flexible and cost-efficient. Panacol complements the new OPV technologies with Elecolit 3648, a newly developed conductive adhesive. Elecolit 3648 addresses one of the critical challenges in the commercialization and long-term reliability of organic solar cells: the creation of durable, flexible electrical connections that establish and maintain reliable electrical circuits. Electronic components are usually connected by soldering. However, soldering materials are rigid and inflexible, and soldering temperatures are often too high for potentially heat-sensitive photoactive materials. Conventional conductive adhesives cure at lower temperatures, but can still be brittle and inflexible. For this reason, Elecolit 3648 is an important innovation: Elecolit 3648 is a very flexible, conductive adhesive. Because it adheres well to plastics such as PI, PC, PVC, ABS and FR4, Elecolit 3648 is the perfect choice for efficiently fixing cables and components to create flexible connections.
Elecolit 3648 can be cured at relatively low temperatures of 80°C within a few minutes. At higher temperatures, Elecolit 3648 can be cured within seconds as a "snap cure" adhesive. As a one-component system, Elecolit 3648 simplifies the manufacturing process as the adhesive does not need to be mixed, ensuring uniform application. It is easy to process and can be applied using conventional dispensing equipment as well as by jetting or screen printing. Elecolit 3648 can efficiently attach flexible resistors and make flexible electrical connections in solar cells to conduct the generated current from the conductors to the end device. This adhesive is also suitable for touch sensors or wearable devices where flexibility is a desired property. These properties make Elecolit 3648 the perfect solution to replace solder joints in applications that are subject to vibration, oscillation or rapid temperature changes. This applies to all configurations of flexible electronics, especially OPV. As the adhesive retains its integrity even after repeated bending and stretching, Elecolit 3648 can help facilitate the development of new devices that can withstand demanding operating conditions without compromising performance.