Call for Papers: Contributions sought for the Copper Symposium 2023

On November 29 and 30, 2023, the Copper Association, as a recognized technological competence center for copper and copper alloys, as well as the trade association of the German copper industry and an international network partner of industry and science, is organizing this year's materials conference, the 18th Copper Symposium, together with the University of Jena, Chair of Metallic Materials. The Copper Symposium is the most important German-speaking platform for a professional exchange of experience between industry and university research and one of the most important materials science events on the subject of copper. In addition to the high-quality technical presentations, participants particularly value the opportunity to exchange views on future developments within materials and production technology and to define new research approaches. The biennial conference offers industry, research institutes and universities the opportunity to intensify dialog and optimize cooperation and is attended by an average of 100 interested parties each year.

In 2023, the main topics of the materials conference will be simulation/modeling, digitization, new materials, additive manufacturing, joining, process engineering, and nano and surface technology. Corresponding abstracts can be uploaded directly on the website as PDFs. Participation as a speaker offers the opportunity to present and discuss topics to a larger expert audience. The integrated poster session also enables an intensive exchange with the conference participants on specific focal points: Independently of participation as a speaker, scientific posters can be submitted, which will be presented in an exhibition accompanying the event. In addition, there is the option to present companies or universities/institutes via a booth booking. The program is expected to be available online at www.kupfer.de by the end of May 2023.