9th "Filmic Contamination" Conference 2026: A Look Back

On October 6 and 7, 2026, 60 participants gathered at The Monarch Hotel in Bad Gögging for the 9th conference on “Film Contamination & Clean Manufacturing Processes,” hosted by Ultima Media Germany GmbH. Experts from industry, research, and applied fields used the event to discuss current challenges and innovative solutions related to film contamination and technical cleanliness. The conference kicked off with presentations on a holistic approach to process chains and the requirements for technical cleanliness. Particular focus was placed on the new DIN 4878-1 standard. Frank-Holm Rögner from the Fraunhofer Institute FEP explained the advantages and limitations of the standard and demonstrated how cleanliness requirements can be designed to be traceable and verifiable. Another key topic was cleanability. Dr.-Ing. Manuel Ulmer of CleanControlling and Christian Worsch of Vacom illustrated how the conditions for optimal cleanability can be established as early as the product development and process design stages. The identification of contamination sources in industrial manufacturing, as well as innovative cleaning technologies, were also examined using concrete real-world examples.

From the Process Chain to Optimal Cleanability

The presentations and panel discussions demonstrated the impact even the smallest residues can have on the quality, functionality, and reliability of industrially manufactured components. The second day of the conference focused, among other things, on the challenges of clean manufacturing processes in electromobility and the special cleanliness requirements in the aerospace industry. Other presentations addressed process monitoring in parts cleaning, dry cleaning of large optical components, and the use of modern sensor technology. Particularly forward-looking were the insights into the use of artificial intelligence to optimize cleaning processes, as well as the potential of simulations and digital twins to improve process stability.